Building the Side Walls
FAIL:
T-Mould failed and was replace by 20 x 2 white profile.
Chip board was 20mm thick and 19 mm thick. The T-Mould had become fragile and no longer flexible. T-Mould profile was no longer symetric in T-shape. Tried to correct with heat-gun but decided to scrap the T-Mould as edge liner.
WORK Practice: the liner was glued and shaped with heat-gun using a single 2600 mm piece of profile. Might be easier to manage if 3 1000 mm profiles are used.
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